Figure 4™ HI TEMP 300-AMB
Figure 4™ HI TEMP 300-AMB is a high-performance photopolymer resin with excellent thermal resistance, stiffness, and stability. Its amber translucency makes it suitable for functional prototypes and demanding end-use applications.
About
Figure 4™ HI TEMP 300-AMB is an advanced photopolymer resin engineered for high-temperature applications. With a heat deflection temperature (HDT) of up to 300 °C, it provides exceptional thermal resistance, making it ideal for testing and production of components exposed to extreme heat. The material also delivers high stiffness, dimensional stability, and excellent detail reproduction. Its natural amber translucency allows visual inspection of internal features, adding versatility for functional prototyping, automotive, aerospace, and industrial applications.
Technical Details
- Accuracy
- ±0.1%
- Density
- 1.3 g/cm³
- Min. wall thickness
- 0.6 mm
Technical Properties
- Tensile strength
- 68 - 81 MPa
- Tensile modulus
- 3800 - 4200 MPa
- Tensile elongation
- 1.9 - 2.6%
- Flexural strength
- 1 - 140 MPa
- Flexural modulus
- 1 - 4260 MPa
- HDT (0.45 MPa)
- 300°C
- HDT (1.8 MPa)
- 300°C
- Embossing
- min. 0.1 mm
- Engraving
- min. 0.1 mm
- Interlocking parts
- Yes
- Warping risk
- N/A