Material
Figure 4® HI TEMP 300-AMB
Figure 4® HI TEMP 300-AMB is a rigid, translucent amber resin with a heat deflection temperature above 300 °C even under higher load, suited to testing high-temperature parts, molds, and flow visualization, though it is brittle.
Manufacturing processes
DLPHPS
About
Figure 4® HI TEMP 300-AMB is a rigid, translucent amber resin with a heat deflection temperature above 300 °C at both low (0.455 MPa) and high (1.82 MPa) stress, and it doesn’t need a secondary thermal post-cure.
It is stiff and fairly strong but brittle. The amber translucency lets users see internal features and fluid flow.
Figure 4® HI TEMP 300-AMB is well suited to testing high-temperature components such as HVAC and motor parts, and to low-pressure molds for foams, rubbers, and silicone.
Technical Details
- Accuracy
- ±0.1% (lower limit of ±0.1 mm)
- Density
- 1.3 g/cm³
- Min. wall thickness
- 0.6 mm
Technical Properties
- Tensile strength
- 68 - 81 MPa
- Tensile modulus
- 3800 - 4200 MPa
- Tensile elongation
- 1.9 - 2.6%
- Flexural strength
- 85 - 140 MPa
- Flexural modulus
- 4000 - 4260 MPa
- HDT (0.45 MPa)
- 300°C
- HDT (1.8 MPa)
- 300°C
- Default layer height
- 0.1 mm
- Default infill
- 100%
- Embossing
- min. 0.5 mm
- Engraving
- min. 0.5 mm
- Interlocking parts
- Yes
- Warping risk
- Low
- Maximum printing dimensions
- 330 × 185 × 375 mm